Sivers Semiconductors AB announced that its business unit, Sivers Wireless, has been granted €496,070 within PARALIA, a new ambitious EU HORIZON Research and Innovation Actions Project launched on January 1, 2023, that aims to develop fundamental innovations in the field of automotive and aerospace applications. The project is coordinated by Aristotle University of Thessaloniki in Greece and will be running throughout the period of January 2023 to June 2026. The total EU funding for PARALIA amounts to €4,995,910.
The consortium is bringing together six leading industrial partners, and three top-ranked academic and research institutes in the PIC and Photonic Systems value chain.
The project aims to demonstrate breakthrough performance by enabling an agile, low-cost, and energy-efficient multi-sensor that combines radar and LiDAR technologies and by re-architecting the sensor ecosystem enabling ultra-high resolution at ultra-long distances crucial for current and futuristic automotive and aerospace applications.
The project targets a powerful common LiDAR/RADAR optical multibeam beamforming platform that will be developed based on the best-in-class multi-port linear optical operator architectures exploiting the synergy of InP and SiN integration platforms.
Sivers Wireless will drive the specification, design, and characterization of a two-dimensional beamforming 77 GHz automotive radar front-end that can be integrated with the common LiDAR/RADAR platform in the project. The 64-channel radar front-end design will leverage the extensive mmWave RFIC and antenna design experience from the 5G wireless field in the company.
“This is an excellent acknowledgment of Sivers Semiconductors as a top tier supplier to be chosen for this project. We have via our Photonics business unit worked on the Lidar sensors for automotive use cases and now also getting EU funding for radar applications as a possible emerging market within Wireless is very encouraging,” said Anders Storm, CEO Sivers Semiconductors.