Qorvo® announced that its RF Fusion22™ chipset has won the 2023 Global TD-LTE Initiative (GTI) Innovative Breakthrough in Mobile Technology Award. The award recognizes Qorvo's technical innovation in 5G chipsets, which combine compact, high performance 5G functionality for leading smartphone manufacturers. This is the third time Qorvo's 5G offerings have been recognized with the GTI Award.

The GTI is an open global association of operators and vendors dedicated to promoting the development of TD-LTE and 5G. The GTI Awards program recognizes the most outstanding achievements and success in the industry and encourages the development of innovative products, services and applications. Qorvo previously won GTI's Innovative Breakthrough in Mobile Technology Awards in 2020 for its RF Fusion™ 5G chipset and in 2018 for its 5G RF front-end.

"We are honored to be recognized again with the prestigious GTI Award," said Frank Stewart, president of Qorvo's Advanced Cellular business. “This award underscores Qorvo's commitment to technology and product leadership in 5G RF front ends. We are proud to offer designers an outstanding solution that fits their new 5G smartphone designs."

Qorvo's Fusion22 solution enables next-generation, high performance functionality to support the continued expansion of 5G into all tiers of the mobile device market. The chipset draws from industry leading technologies (BAW, SOI, GaAs HBT) and deep experience in radio architecture to provide a high performance solution for the next generation of 5G handsets. Each module is optimized and tested as a complete reference design, enabling manufacturers to leverage pre-validated interoperability and high levels of integration to minimize engineering effort and lower design risk.

Part Number



Family of MHB, integrated LNA, PA modules with integrated duplexers (L-PAMiD)

QM77055 / 77052

Low band L-PAMiD


Ultra-high band PA module with LNA and integrated filters (L-PAMiF)