Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak open-molded plastic packages (OmPP®) are RF-capable to data rates of 43 GHz, which will help speed availability of semiconductor devices for 5G and IoT mmWave applications. The packages are available now from Quik-Pak as both off-the-shelf and custom offerings.

Each company contributed core technology to the project: Quik-Pak’s OmPP air-cavity open-molded QFN packages, AgileMwT’s interconnect design and test capabilities, and OMMIC’s MMIC GaN-based design and manufacturing processes. The team successfully completed electrical RF characterization of the OMMIC die and Quik-Pak OmPP package and confirmed 5G-capable frequencies.

mmWave radio frequencies are well suited for 5G networks. Unlike the sub-5 GHz frequencies previously used by mobile devices, mmWave technology allows transmission on higher frequencies previously used primarily by radio systems and satellites. Today, these frequencies are being used to connect mobile devices to base stations, as well as for IoT and other applications that require much higher data rates and reliability and lower latency. Moreover, using wide-bandgap GaN die allows devices to reach high power densities (up to 4 W/mm) and output power in a smaller space with greater power efficiency and low energy consumption, promoting robustness in high-frequency devices for 5G applications. As use of these technologies and interconnected communications grows more widespread, a near-infinite number of solutions stands to benefit from the Quik-Pak air-cavity QFN packages.

“For 5G devices, stringent interconnect design, materials and assembly techniques are paramount to ensuring these chips can achieve 26- to 43 GHz data rates, which are the sweet spot for 5G mmWave frequencies,” said Quik-Pak Chief Operating Officer Ken Molitor. “I’d like to thank the teams from Agile Microwave and OMMIC for helping verify that Quik-Pak’s OmPP packaging is RF-capable and ready to deploy in 5G and future 6G solutions.”