StratEdge Corp. announces it has selected Casey Krawiec as vice president of global sales. Krawiec will be responsible for the global sales of StratEdge's high speed, high frequency semiconductor packages and StratEdge's assembly and test services.
Krawiec has worked for companies involved with wafer preparation, microelectronic assembly, and packaging for almost 25 years. After earning a Bachelor of Science degree in Mechanical Engineering from the University of Kentucky and a Master of Business Administration from the University of Louisville, Krawiec was a design engineer for the Department of Defense for several years. He began his career in microelectronics at Kyocera, worked for 6 1/2 years at StratEdge, and most recently, was director of sales and marketing at Quik-Pak.
Krawiec has developed and taught several introductory courses on microelectronic packaging for the International Microelectronics and Packaging Society (IMAPS). He's a past chair of the San Diego IMAPS chapter and has been involved with mentoring engineering students at San Diego universities.
"With its expertise with high-performance, high-frequency packaging, StratEdge is poised to be a key supplier for companies producing high-frequency and high-power chips," said Krawiec. "There are numerous applications involved with 5G build-out, satellite programs, automotive, and other industries where StratEdge's technology will be highly advantageous. I am excited to be back at StratEdge to lead its worldwide sales effort."
"We are glad to welcome Casey back to StratEdge," said StratEdge president and CEO Tim Going. "Casey's technical background and years of experience in the packaging world enable him to work with our customers to ensure that they get the packages and assembly and test services that best suit their devices and applications."