MATERIALS
PTFE Laminates
The RO3200™ series woven glass reinforced, ceramic-filled polytetrafluoroethylene laminates have good characteristics, including stable dielectric constant over temperature and low dielectric loss. The laminates offer increased rigidity and improved processability over nonwoven reinforced laminates. The models RO3203™ and RO3210™ are available with electrodeposited copper as a standard, and with rolled copper or heavy metal cladding. The RO3203 features a dielectric constant of 3.02 and dissipation factor of 0.0016, and is available in dielectric thicknesses of 0.010", 0.020", 0.030" and 0.060". The RO3210 features a dielectric constant of 10.2 and dissipation factor of 0.003, and is available in dielectric thicknesses of 0.025" and 0.050".
Rogers Corp., Microwave Materials Division,
Chandler, AZ
(602) 961-1382.
Wire EDM Carriers
These wire electric discharge machining (EDM) method carriers have a typical tolerance of +/-0.0002". Carriers are also available constructed of molybdenum or clad materials. Both plated and unplated carriers can be supplied upon request.
Microcut Co. Inc.,
Cupertino, CA
(408) 446-1336.
High Performance Metallized Substrates
These thin-film ceramic substrates for MIC applications feature tantalum nitride resistor films that can be temperature stabilized at over 450°C for improved performance. Once stabilized at this high temperature, the resistor values will remain unchanged after brazing and assembly using AuGe at 400°C. Multilayer metallization schemes employ diffusion barriers such as nickel, palladium and platinum for solder-down applications.
UHV Sputtering,
San Jose, CA
(408) 446-1336.