SANTA CLARA, Calif., January 25, 2011 – Agilent Technologies Inc. (NYSE:A) today announced it will demonstrate its high-speed digital test solutions at DesignCon 2011, Jan. 31- Feb. 2, at the Santa Clara Convention Center, Booth 201.

Agilent’s unique solution set ensures the best digital test tools for smartphones, laptops, and emerging devices. High-speed digital products include tools for high-performance probing, signal integrity testing, high-speed interconnect analysis/simulation, jitter analysis, FPGA debugging, and analysis of FBD/DDR memory, Serial-ATA, PCI Express®, USB 3.0, HDMI 1.4, DisplayPort, Gigabit Ethernet and Fibre Channel.

Agilent at DesignCon 2011
IBIS AMI model simulation with Agilent’s EDA tool, ADS 2011.01. The input/output buffer information specification algorithmic modeling application programming interface (IBIS AMI) standard allows IC vendors to share “executable datasheets” of the high-speed digital SERDES without proprietary encryption.

Power integrity solutions with Agilent’s ADS Momentum. ADS 2011.01 solves power integrity problems that are complicated by heavily perforated power and ground planes. Momentum now models the effects of frequency-dependent dielectric loss and the surface roughness of copper traces.

Simulation and measurement tools using Agilent’s N1010A FlexDCA Remote Access Software. The tools help engineers characterize high-speed digital designs with improved margins and offers de-embedding, embedding, offline analysis, and built-in simulator capability. To validate IBIS-AMI models, engineers can compare simulated signals generated by Agilent’s SystemVue software with actual hardware measurements performed using the 86100C/D DCA oscilloscope.

Physical layer test with the Agilent’s N1930B (PLTS). Software version 6.0 provides additional features to complement the signal integrity laboratory. It allows users to add automatic calibration and measurement to the test suites. A new data integrity check allows users to verify and enforce the passivity, reciprocity and causality of S-parameters.

Interconnect analysis using Agilent’s 16-port 70-GHz PLTS. This system enables industry-first bandwidth of 70 GHz with 16 ports for measurement of four differential channels simultaneously. Employing an electronic calibration module, users can make a complete 16-port measurement in less than three minutes. The resulting ‘filename’.s16p Touchstone file enables worst-case crosstalk analysis of four differential interconnect channels. PCIe® 3.0 receiver tolerance characterization with the Agilent J-BERT N4903B. For R&D and validation teams, this product provides accurate receiver tolerance testing of PCI Express 3.0, USB 3.0, SATA, QPI and other serial bus interfaces operating up to 14.2 Gb/s.

Digital and mixed signal test with Agilent 81160A Pulse Function Arbitrary Noise Generator. This is a plug-and-play solution, with minimal cabling, low space overhead and functions built in to reduce development time. The pulse function arbitrary noise generator is an adaptable and efficient test tool to accurately test devices and not your test source / stimulus up to 330 MHz pulse, 500 MHz sine waves and random and repeatable white Gaussian noise.

High-speed digital design measurements with the new Agilent 86100D DCA-X Wide-Bandwidth Oscilloscope. This is a premier solution for accurate and precise measurements from 50 Mb/s to over 80 Gb/s. The modular DCA platform can be configured for electrical, optical, TDT/TDT and S-parameter measurement supporting up to 16 measurement channels.

Debugging data signal integrity using the Agilent ENA Option TDR. The ENA Option TDR is a one-box solution for analyzing high-speed serial interconnects, including TDR/TDT, eye diagrams, and S-parameters. Inheriting the excellent accuracy of the E5071C network analyzer and adding the versatility of TDR oscilloscopes, the ENA Option TDR changes the world of TDR measurements, providing fast and accurate measurements, simple and intuitive operation, and robustness against ESD. Agilent also offers method-of-implementation (MOI) documents for compliance testing high-speed serial standards such as USB 3.0, HDMI and Serial-ATA.

Agilent presentations and forum topics include:
• “A Really Simple Method to Characterize Differential Interconnects”;
• “Measurement Uncertainty of VNA-Based TDR/TDT Measurement”;
• “USB 3.0 Serial Link Design, Optimization and Validation”; and
• “A Simple, Yet Powerful Method to Characterize Differential Interconnects.”

Jay Alexander, general manager and vice president of Agilent's oscilloscopes business will give the DesignCon 2011 keynote – “The Electronics Industry in 2011 and Beyond: Observations and Opportunities” – at noon on Feb. 1.

Agilent experts will be on hand in Booth 201, demonstrating Agilent’s high-speed digital solution set. The solutions provide a range of essential tools for engineers in design and simulation, helping them cut through the challenges of gigabit digital designs.

Agilent is the official sponsor of this year’s event. Additional information is available at