M/A-COM Launches RFIC Assembly and Testing Services

M/A-COM, a business unit of Tyco Electronics and a provider of wireless radio frequency (RF), microwave and millimeter-wave components, announced the Radio Frequency Integrated Circuit (RFIC) assembly and testing service targeted towards commercial and defense applications and manufacturers. Based in the company's Lowell, MA facility, M/A-COM's reduced time-to-market assembly and testing services include the design, manufacture and test of RFIC multi-chip modules for ceramic, ball grid array (BGA), land grid array (LGA) and chip scale devices.

From prototype to production, M/A-COM offers the following process capabilities for RFIC assembly and packaging:

· Auto epoxy and eutectic die attach

· Auto ball and wedge bonding

· Low volume SMT (0201 placement)

· Eutectic and B-stage lid seal

· Fine and gross leak testing

· Auto liquid encapsulation

· Laser mark and auto scribe

· Auto solder ball attach

· Auto saw and trim & form

· Auto test

· Environmental screening

M/A-COM also offers the following design, manufacture and test competencies:

· Process engineering

· Mechanical/tooling design (2D & 3D)

· Packaging design

· NPD and quick-turn prototyping (TTM)

· Continuous improvement (Six Sigma)

· Test interface development

· Test automation and data analysis

· Supporting high volume and high mix