EDI CON 2013 Conference

EDI CON 2013 Conference and Plenary presentations and papers


Spirent Leads the Conversation on MIMO OTA testing and Channel Emulation at EDI CON

Modern wireless technologies such as LTE (including LTE-Advanced and TD-LTE) rely on Multiple-Input Multiple-Output (MIMO) and beamforming technology to deliver higher data rates, greater coverage, and lower operational costs. However, RF testing of base station and mobile device receivers is both complex and critical. A leader in the art of RF channel emulation, Spirent offers the most accurate, efficient and complete solutions for testing modern receivers including realistic MIMO emulation, OTA testing and virtual drive testing. Spirent will be discussing its MIMO OTA solutions as a Gold Sponsor of EDI CON 2014 and host of the MIMO OTA expert panel.

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EDI CON Papers Focus on MIMO Technology

 EDI CON 2014 to be held at the Beijing International Convention Center, April 8th through 10th will feature a dozen technical papers and workshops on MIMO design and related test/verification solutions. The following is a summary of the paper topics and speakers presenting their work in this area. In addition, the exhibition will feature products and demonstration from leading MIMO test and measurement equipment providers such as Spirent Communications, Agilent Technologies, Microwave Vision Group, General Test Systems (Tri-L), National Instruments and more.

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MACOM to showcase highly integrated, plastic-packaged GaN solutions at EDI CON

M/A-COM Technology Solutions Inc.(“MACOM”), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.

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RF Semiconductor Technology Drives the EDI CON 2014 Technical Program

From technical sessions, panels and workshop, RF IC front-ends will be under the spotlight

Integrated circuits and semiconductor technology are critical to the overall performance of electronic systems, whether the application is for mobile communications, radar or satellite navigation. The design track reflects the industry’s focus on recent advances in design technology with an emphasis on specific components such as filters and power amplifiers. Doherty and class-F PA architectures along with techniques such as digital pre-distortion and envelop tracking that are garnering so much industry attention at the moment will be among the hot topics presented in the field of power amplifier design.

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Peregrine Semiconductor to Unveil Global1 to China Market at EDI CON 2014

World's first re-configurable RF front-end system

Peregrine Semiconductor Corp. has announced the China debut of its UltraCMOS® Global 1, reconfigurable RF front end (RFFE) at EDI CON 2014. Company representatives will hold a special on-site press conference for local media serving the wireless industry in China. The new device which was initially introduced at Mobile World Congree in Barcelona supports over 40 frequency bands and a more than 5,000-fold increase in the number of possible operating states, a truly reconfigurable RFFE is now a requirement. This level of reconfigurability is only feasible with a CMOS process. Global 1’s entire system – multimode, multiband (MMMB) power amplifier; post-PA switch; antenna switch; and antenna tuner, on a single chip – is based on Peregrine’s UltraCMOS 10 technology platform. For the first time, 4G LTE platform providers and OEMs will be able to save time and money by creating a single-SKU design for global markets.

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EDI CON 2013 Proceedings

Beijing China, March 12-14
EDI CON 2013 proceedings including papers, presentations and workshop slides. The papers and presentations are arranged by track, day and session time. Website registration/login is required to view the materials.
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