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Items Tagged with 'tin/lead'

ARTICLES

Gowanda first to offer QPL RF chip inductors with tin/lead solder terminations

Aerospace & Defense

Gowanda Electronics recently achieved qualification to the military’s MIL-PRF-83446 specification for its MLRF0603 and MLRF0805 series of RF surface mount wirewound coil, ceramic core chip inductors with tin/lead terminations. 


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AEM's tin whisker mitigation process assures surface-mount component reliability

AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations con­tain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.


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