Items Tagged with 'tin/lead'

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AEM's tin whisker mitigation process assures surface-mount component reliability

AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations con­tain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.


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