Pat Hindle, MWJ Editor
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Hindle
Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

Microwaves Go International in Last Quarter of 2012

August 31, 2012

As the kids head back to school and the weather in the north starts to chill, the microwave industry takes on an international flavor with European Microwave Week(EuMW) starting in the end of Oct in Amsterdam, the Military Communications Conference (MILCOM) in Orlando the same week, the China International Exhibition on Microwave and Antenna (IME) in Shanghai in early Nov and the Asia Pacific Microwave Conference in Taiwan in early Dec.  Microwave Journal will be represented at all of these shows with additional distribution of our magazines and editors/staff on location at most of these conferences.  Also, mark your calendars for next year for EDI CON 2013 in Beijing March 12-14 (contact us for paper submissions and exhibition space for this new and unique approach to conferences).

We will kick off our Online Show Daily coverage of EuWM 2012 in October with a micro-site on our web site and periodic newsletters highlighting news, products, technical sessions, the conferences, the defense forum and the EuMW exhibition.  The newsletters are available for sponsorship.

The editorial features coming up in our October issue, themed as Government and Military Electronics, take a look interfering signals from capture and playback to spectrum analysis for both military and commercial applications.  Other planned editorial includes replacement of TWTs with GaN SSPAs, a new tile structure for vertical microwave module integration and CMOS on sapphire for low power devices.

In November, our issue is themed for Passive and Control Components and we cover the state of tunable devices for handset antennas in our cover story.  Other features include a new look at phase noise analysis and design techniques to minimize power drain.  November also includes our annual Mobile Communications supplement that focuses on Mobile World Congress (MWC) with extra distribution at the show.  Our cover story features the leading microwave companies talking about what they view as being the hot trends at MWC in addition to features covering carrier aggregation and analog linearization techniques.

December is our Industrial, Scientific and Medical Applications theme that will look to the future with “Get Ready for 5G,” wireless medical technologies and microwave reactors for industrial processing.  This is always an interesting issue covering a broad range of topics.

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