Articles Tagged with ''design''

EDI CON China 2018 Announces Winners In Innovation Awards

Winners announced in test & measurement, software/EDA, semiconductors, components and materials.

Last night, at EDI CON China 2018 the winners were announced in the EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.


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Volta Series Probe

Smiths Interconnect announces the release of the Volta Series probe heads optimized for wafer level chip scale package testing. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.


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NI AWR Software Featured at EDI CON 2017 in Booth Demonstrations and at Workshop/Technical Sessions

The latest release of NI AWR Design Environment, V13, will be on display at the Electronic Design Innovation Conference (EDI CON) 2017, being held
in Shanghai, China on April 25-27. In addition to software demonstrations within NI Booth #311, the NI AWR software product portfolio will be featured in one 40-minute workshop and two 20-minute technical sessions. NI AWR software activities during EDI CON include:


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