Texas Instruments (TI) announced the availability of the next device in the SimpleLink™ ultra-low power platform, designed to help customers easily add ultra-low power, long-range connectivity to their Internet of Things (IoT) designs. The new SimpleLink Sub-1 GHz CC1310 wireless microcontrollers (MCUs) offers up to 20 years of battery life for building and factory automation, alarm and security, smart grid and wireless sensor network applications.
NI (formerly AWR Corp.) announces the agenda has been set and registration opened for its annual combined AWR Design Forum (ADF) 2015 / German User Group meeting being held November 26, 2015 at the NI European Headquarters in Munich.
Keysight Technologies, Inc. announced an extension to the IntegraVision family of power analyzers, the first in the industry to combine high-accuracy power measurements and touch-driven oscilloscope visualization in a single instrument. The Keysight IntegraVision PA2203A 4-channel power analyzer gives R&D engineers working on three-phase power devices an intuitive tool that delivers the dynamic views they need to see, measure and prove design performance.
EnSilica has established a new regional office and design center in Bristol to complement its existing headquarters facility in Wokingham and verification center of excellence and design center in Bangalore.
NI (formerly AWR Corp.) announces that NI AWR Design Environment™ V12 will be showcased in a full slate of events at the International IEEE Conference on Microwaves, Communications, Antennas and Electronic Systems (IEEE COMCAS 2015), which will be held in Tel Aviv, Israel, November 2-4, 2015.
Molex, LLC will bring its deep expertise and wide range of aerospace and defense industry solutions that meet high-performance needs to booth 433 at the Military Communications Conference (MILCOM), to be held October 26-28 at the Tampa Convention Center in Florida. By integrating speed, compact design and military-grade construction, as well as forming strategic partnerships and making acquisitions, Molex has developed an extensive portfolio of products that withstand harsh A&D applications.
Mentor Graphics Corp. announced new PADS® 3D tool capabilities plus major usability enhancements to the PADS flow for printed circuit board (PCB) design. The new technology provides visualization, placement, and design rule checking in 3D, minimizing iterations with mechanical and manufacturing teams. Schematic design and layout enhancements improve usability across the flow for increased user productivity.