Current market demands in wireless communications require that equipment suppliers lower costs and increase performance. As Mimix Broadband sees it, this trend forces design engineers to develop higher levels of product integration to meet these requirements.
The key to this technology is the integration of up to four functions or more into a single MMIC. Integration offers a number of benefits for microwave and millimeter-wave components, including lower costs and variability of transceivers from using fewer parts, a smaller footprint area and a simpler design. It also reduces the need for off-chip interstage matching between RF components.
In addition to the development of highly integrated devices, increasingly more microwave and millimeter-wave devices are being housed in standard QFN surface-mount packages. The continued growth in wireless communications has placed tremendous pressure on component manufacturers to provide standard QFN surface-mount packaged products for large scale PCB assembly flow, in order to lower costs and ease handling and assembly for mass production. IEEE MTT-S IMS is a forum for trends like product integration and packaging, bringing together premiere equipment suppliers and advanced design engineers to meet industry requirements.
The quality of the conference, with its high-level technical paper presentations and resulting exhibition attendance, is a unique opportunity for both sides of the industry to share needs and solutions, research and developments. Specifically, we develop microwave and millimeter-wave products in close partnership with top-tier telecom, satellite and defense companies. In addition to catalog products, we provide custom designs that meet our customers’ specifications. Using a two-prong strategy for new product development means Mimix provides innovative technology that solves our customers’ technical challenges and keeps up with the markets’ requirements.
Mimix is proud to support the 2008 IEEE MTT-S IMS as a sponsor, as we have done for the last several years. As one of the industry’s premiere events, we have regularly introduced new products and services here.
This year, we are featuring Mimix SmartSets – our innovative QFN packaged chipset solutions that lower material and assembly costs and increase reliability and manufacturability of products, while also allowing engineers to simplify design and improve time-to-market. They are available from 5 to 40 GHz. Detailed product information can be found at our booth #1423 and on our web site at www.mimixbroadband.com/smartsets.