Workshops & Courses

International Workshop on Wafer Level CSP and Flip Chip Packaging
Topics : Wafer level packaging materials and processes, wafer level burn-in and test, small die and memory products, ultra-high density substrate technologies for WLP, new and advanced wafer technologies, wafer package reliability.
Site : Stone Mountain, GA
Dates : March 1-3, 2002
Contact : Rao Tummala, Georgia Institute of Technology, e-mail:

Wideband CDMA for UMTS/UTRA
Topics : This course will cover principles, technologies, system architectures, standards, main applications and expected future trends in the field. Emphasis will be on applications in personal, indoor and the third generation of land and satellite mobile radio communications.
Site : Davos, Switzerland
Dates : March 11-15, 2002
Contact : CEI-Europe, Box 910, S-612 25 Finspong, Sweden +46 1222 175 70 or e-mail

Application Specific Integrated Circuits
Topics : This course provides everything one must do to begin, understand and complete the design of an electronic system containing modern deep submicron application specific integrated circuits (ASICs).
Site : Davos, Switzerland
Dates : March 18-22, 2002
Contact : CEI-Europe, Box 910, S-612 25 Finspong, Sweden +46 1222 175 70 or e-mail

MEMS for RF/Wireless Applications
Topics : This course provides a clear understanding of the potential and limitations of MEMS as applied to RF/wireless communications systems. Test included with registration, "An Introduction to Microelectromechanical (MEM) Microwave Systems."
Site : Waltham, MA
Date : April 5, 2002
Contact : Bob Alongi, IEEE Boston Section, (781) 890-5290, fax (781) 890-5294.

RF Power Amplifiers, Classes A Through S
Topics : How the circuits operate, how to design them and when to use each of them. Course is designed for those concerned with designing any type of RF power amplifier product.
Site : Waltham, MA
Date : April 24, 2002
Contact : Bob Alongi, IEEE Boston Section, (781) 890-5290, fax (781) 890-5294.

Advanced Technology Workshop on Ceramic Technologies for Microwave and Photonic Packaging
Topics : Critical issues in packaging for microwave and photonic technology, essential in reducing time-to-market, costs and wide-scale deployment of these rapidly growing technologies.
Site : Providence, RI
Dates : May 2-3, 2002
Contact : IMAPS, 611 2nd Street, NE, Washington, DC 20002 (202) 548-4001, fax (202) 548-6115 or e-mail:

Antennas: Principles, Design and Measurements
Topics : Antenna fundamentals, arrays, wire antennas, broadband antennas, horns, reflectors, antennas in systems, antennas for wireless communications and measurements. For additional information visit www.
Site : Orlando, FL
Dates : May 20-23, 2002
Contact : Leanne Traver, NCEE, 68 Port Royal Square, Port Royal, VA 22535-0068 (804) 743-5611, fax (804) 742-5030.

Advanced Technology Workshop on Passive Integration
Topics : Design, simulation and libraries, material systems, fabrication of passive elements in component platforms, capacitors, connectors, diodes, flex circuits, ferrites, inductors, resistors, thermistors and varistors.
Site : Oqunquit, ME
Dates : June 19-21, 2002
Contact : Robert Hestand, AVX Corp. (843) 444-2886, fax (843) 448-2106 or e-mail: