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5G and IoT Supplement
Production Flip-chip Bonder
The model FC250 high end, production flip-chip bonder offers alignment and leveling accuracy better than 2 mm. The throughput lies over 200 units per hour. A production-worthy system to level, align and bond even nonreflective components, the bonder supports the complete range of bonding applications, including multichip modules, focal plane arrays, laser diodes, chip-on glass and flat-panel displays. Flexibility is maximized through a multiformat feed capability, hands-off operation in the production environment, and temperature and force profiling.
Karl Süss KG GmbH & Co.,
Garching, Germany +49 (0)89 32 00 72 37.
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