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Agilent Technologies announces shipment of the IC-CAP 2012 platform for device characterization and modeling
Agilent Technologies Inc. announced shipment of the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).
The new IC-CAP release radically changes the way data is stored, analyzed and selected for modeling tasks, greatly increasing workflow efficiency and ensuring continued data integrity and traceability. IC-CAP's automated measurement solution, Wafer Professional (or WaferPro), can now access a new SQL database called IC-CAP Database. Destined to become the backbone of the device modeling flow, the new database can simplify the way device modeling teams operate.
A new tool called DataPro is also integrated with IC-CAP Database. DataPro enables rapid analysis and selection of data for the final model parameter-extraction process.
An accurate description of process variations when modeling today's advanced semiconductor processes has become a core requirement for circuit design teams. At the beginning of the modeling flow, IC-CAP WaferPro enables engineers to execute complex measurement tasks and collect high volume data for analyzing statistical trends. Writing data directly to a database simplifies data storage, improves security and maintainability, and enables complex queries to be completed extremely fast. DataPro helps identify and eliminate outlier devices/dies that show unphysical behavior or a large statistical deviation from the mean. It then performs statistical analysis on selected targets and identifies the golden and corner dies to be used for model extraction.
"As the leading provider of semiconductor device modeling solutions, we continue to innovate to improve flow efficiency and model accuracy," said Chris Morton, device modeling business manager with Agilent EEsof EDA. "Breakthrough capabilities like IC-CAP Database and DataPro enable our customers to focus their modeling resources on the core modeling task, knowing that their data is organized and secure."
Rapid Data Analysis and Selection
Agilent's new W8503 IC-CAP DataPro connects to database or file repositories. A convenient user interface let users select target data for statistical analysis. Selected targets can be either I-V curves, such as Id versus Vd or spot data, such as Vth or Idmax. The program runs statistical analysis on the target data and calculates mean values and variances. Statistical graphics such as histograms are available to allow users to inspect data and its distribution, and identify and eliminate outliers. The software then pinpoints the golden die to be used for typical device model extraction and the corner dies to be used for corner modeling.
New IC-CAP 2012.01 Features
In addition to the SQL database support and DataPro, IC-CAP 2012.01 provides new features and enhancements, such as a reduced memory print (up to 5x) to allow loading of very large data files and a driver for the new Agilent B2900A Series source/measurement unit. Existing DC analyzer instrument drivers have also been enhanced to support time-domain measurements and higher resolution. In addition, IC-CAP 2012.01 introduces a new simplified licensing and product structure. Major changes include introduction of a new bundle, the W8500, to replace the former Modeling Suite; a new W8520 Instrument Connectivity product that includes all drivers; and the inclusion of target and corner modeling packages into all CMOS extraction packages. More information on the new product structure is available at www.agilent.com/find/eesof-iccap.
Agilent IC-CAP software is a device-modeling program that delivers powerful characterization and analysis capabilities for today's semiconductor modeling processes. Providing efficient and accurate extraction of active device and circuit model parameters, IC-CAP performs numerous modeling tasks, including instrument control, data acquisition, graphical analysis, simulation and optimization. It is used by semiconductor foundries and design houses to characterize foundry processes.
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