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The German V3DIM (standing for design for vertical 3D system integration in millimetre-wave applications) research project aims to lay the foundations for establishing the design requirements to develop innovative, highly integrated 3D System-in-Package (SiP) solutions for systems in the 40 to 100 GHz range.
Five partners from industry, science and research have joined forces in the project funded by the German Federal Ministry of Education and Research (BMBF) to explore how innovative 3D integration technologies can be exploited in chip and package manufacture. In their quest, special attention will be paid to miniaturization, performance (including power loss, signal integrity, noise and cost), energy efficiency and reliability.
The five project partners are Fraunhofer Institutes in Dresden, Munich and Berlin lead-managed by the Dresden Institute for Integrated Circuits, SYMEO GmbH, Siemens AG, the Institute of Technical Electronics at the University of Erlangen-Nuremberg, and the project manager, Infineon Technologies AG.
The project is scheduled for completion at the end of August 2013. The five partners will devise new design methods, models and SiP technology components to meet the special challenges of vertical 3D system integration in the sphere of millimetre-wave applications.
V3DIM’s overall project cost amounts to €6.8 M, with approximately 40 percent being funded by the three industry project partners. In addition, the project will receive BMBF support of about €4.1 M over a three-year term under the Information and Communications Technology 2020 (ICT 2020) programme as part of the German Federal Government’s High-Tech Strategy. The V3DIM project also collaborates closely with the European CATRENE 3DIM3v project, which works on complementary aspects of vertical 3D system integration.
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