Items Tagged with 'leti'

Leti will provide access to the Mentor Veloce^® high-capacity, high-speed, multi-application emulator to SMEs and start-ups in Europe.

Leti is marking its 50^th anniversary this year with industry events and workshops in Grenoble, Tokyo, Taipei and San Francisco.

Leti presented a paper at the 11th European Conference on Antennas and Propagation on March 21 that characterizes the propagation channel in the V and E-bands for indoor scenarios.

Leti, an institute of CEA Tech, and the Institute for Information Industry of Taiwan (III), a non-profit non-governmental technology development organization, today announced an agreement for mutual exploration of a wide range of information and communications technology (ICT) related to the Internet of Things (IoT) and 5G wireless connectivity.

CEA-Leti will make two presentations during the EU-Japan Symposium on 5G – "From Challenges to Standardisation" – in Tokyo on 8-10 February.

CEA-Leti announced an agreement with Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., to assess the feasibility and the value of Leti’s sequential 3D technology.

BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880 m (standard regulation) and 3,641 m (emergency situations).

CEA-Leti and Agilent Technologies will present their recent research results in the field of embedded integrated systems at the IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Conference in Austin, TX, Jan. 21-23.