Items Tagged with 'integrity'

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 

TE Connectivity Ltd., a world leader in connectivity and sensors, announced that its new Raychem high-speed data transmission cables for IEEE 1394 applications. Designed for use with military ground, military and commercial aerospace and marine systems, the ruggedized cable helps block out excess noise in harsh environments to enable dependable signal integrity in extreme conditions.

Horizon House Publications announces the launch of Signal Integrity Journal, a sister publication to Microwave Journal, covering signal integrity, power integrity and EMC/EMI related topics. Signal Integrity Journal will be the first peer reviewed, industry journal to cover these markets. Signal Integrity Journal is initially launching as a website, www.signalintegrityjournal.com, and plans to start publication of the periodical journal in 2017. The website is now available as a beta version with content being added quickly for full release shortly.

Computer Simulation Technology has acquired IdemWorks, an industry leading provider of modeling tools and services.

Anritsu Co. continues to address the test needs of signal integrity (SI) engineers with the introduction of options for its VectorStar® and ShockLine™ vector network analyzers (VNAs). The VectorStar Eye Diagram and ShockLine Advanced Time Domain (ATD) options are part of the expanding SI capabilities offered by Anritsu and provide SI engineers with improved tools to conduct channel diagnostics and model validation of high-speed digital circuit designs.

Mentor Graphics Corp. announced its newest HyperLynx® release which integrates signal and power integrity analysis, 3D-electromagnetic solving, and fast rule checking into a single unified environment.

Mentor Graphics Corp. announced its newest version of the HyperLynx® Signal Integrity/Power Integrity (SI/PI) product for high-speed printed circuit board (PCB) designs. The HyperLynx product addresses high-speed systems design problems throughout the design flow—starting at the earliest architectural stages through post-layout verification.

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, announced that its wafer fabrication facility in Lowell, Massachusetts, has been accredited by the Department of Defense (DoD) as a Category 1A Trusted Foundry. This DoD accreditation distinguishes MACOM as a trusted manufacturer of integrated circuits (ICs) for classified and unclassified U.S. military and aerospace applications.

High Speed Interconnects (HSI), a full service cable extrusion and coaxial assembly manufacturer, announces increasing capabilities to solve custom, small form factor interconnect challenges.

UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, will welcome thousands of influential members of the chip, package and board design communities to DesignCon 2014, January 28 – 31, at the Santa Clara Convention Center in Santa Clara, California. Recognized as the premier annual trade event and technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design, DesignCon will host Keynote Speakers from Intel, Micron Technologies and XPRIZE.