RF & Microwave Summit

Title: RF & Microwave Summit: Extreme RF

Date: April 22, 2026

Time: 10am PT / 1pm ET

Sponsored by: Maury Microwave, Teledyne Storm Microwave, Teledyne HiRel Semiconductors and Micable

Abstract:
Extreme RF explores the technologies pushing radio frequency and microwave engineering to the limits of performance, power, and environment. This half-day online summit brings together industry experts to examine how RF innovation is enabling next-generation systems in space and satellite communications, quantum computing, high-power and high-frequency electronics, massive MIMO architectures, and mission-critical systems operating in harsh environments. Speakers will discuss the design, materials, modeling, and measurement challenges associated with operating at extreme frequencies, power levels, temperatures, and reliability requirements. Attendees will gain insight into emerging device technologies, advanced packaging, and system architectures that are redefining what is possible in RF and microwave engineering across aerospace, defense, communications, and computing applications.

Moderator: Pat Hindle, Media Director, Microwave Journal^®
Panelist: Giampiero Esposito, Business Development & Product Line Manager, Maury Microwave
Panelist: Patrick Melehan, Applications Engineer, Teledyne Storm Microwave
Panelist: James F. Salzman, Senior Chief Technology Officer, Teledyne HiRel Semiconductors
Panelist: Wei Liu, Co-Founder of Micable Inc., Micable Inc.

Panel Participant Bios:

Moderator – Microwave Journal^®
Pat Hindle, Media Director

Pat Hindle is media director for Microwave Journal® and has been with the magazine for more than 17 years. He parlayed his process engineering background into a management role in marketing communications for several leading microwave semiconductor manufacturers including MACOM, Raytheon and Skyworks (Alpha Industries), in addition to working at MIT Nanostructures Laboratory manufacturing X-ray diffraction gratings for space research telescopes like Chandra. He has a B.S. in Materials Science Engineering from Cornell University and MBA from Northeastern University. In his current role as MWJ editorial director, he is responsible for setting MWJ’s editorial direction and developing marketing opportunities for industry clients. He created the RF and Microwave Community on LinkedIn with more than 100,000 members plus co-hosts the popular Frequency Matters videos and podcast series.

Maury Microwave
Giampiero Esposito, Business Development & Product Line Manager
Technical Talk - 10am PT / 1pm ET: High-Power Solutions for Tomorrow's Extreme RF Challenges: Upcoming 50 GHz EMC Demands

Giampiero Esposito is the Business Development and Product Line Manager at Maury Microwave Corporation and is responsible for product line successes including market intelligence, sales enablement, planning, development, and lifecycle management of products.

He joined the company in October 2012, as an application engineer responsible for product support and has since held various technical, management positions within the company.

Giampiero received the B.Eand M.S degree in 2009 in Electrical Engineering from the University of Naples, Italy with an emphasis in RF Microwave. His thesis was performed at University of Delft, the Netherlands, where he developed new techniques for noise parameters characterizations.

Teledyne Storm Microwave
Patrick Melehan, Applications Engineer
Technical Talk - 10:30am PT / 1:30pm ET: Precision Under Extremes: Interconnect Technologies for High Reliability RF Systems

Patrick Melehan serves as an Applications Engineer at Teledyne Storm Microwave, bringing nearly two decades of expertise to the role. Over the years, Patrick has played a key part in supporting both customers and internal teams, drawing on a deep knowledge of RF and microwave interconnect solutions. Collaborating closely with engineering, sales, and clients, Patrick excels at transforming complex technical requirements into practical, application-ready designs. Patricks’ extensive tenure at Teledyne Storm Microwave highlights a solid track record in optimizing product performance, delivering exceptional customer support, and addressing real-world challenges in RF technology.


Teledyne HiRel Semiconductors
James F. Salzman, Senior Chief Technology Officer
Technical Talk - 11am PT / 2pm ET: The Effects of Hydrogen Intoxication in Hermetic, Non-Hermetic, Space, and Non-Space RF Application

James has over 20 years of experience in defense, space, and radiation hardened semiconductor technology, including senior technical and leadership roles at Texas Instruments and Raytheon, where he contributed to 12 DoD missile and space programs and developed the world’s first deep trench bonded SOI process. He later led RF and space technology initiatives at TI HiRel, launching the first space product strategy, advancing radiation hardened processes and QMLV RHA products, and earning multiple industry awards.

He currently serves as the Teledyne HiRel Semiconductors CTO. He is a Life Senior member of IEEE, a JEDEC 13.4 radiation test standards leader, a Registered Professional Engineer in Texas, has authored or coauthored some 30 papers, and holds 12 patents, including a fun personal wine patent in 2019, Methanol Slicing of Wine. US10428298B1.

Micable Inc.
Wei Liu, Co-Founder of Micable Inc.
Technical Talk - 11:30am PT / 2:30pm ET: Wide and Ultra-wide Band High-power Directional and Dual Directional Couplers and Their Enabled Applications

Wei Liu is the Founder and President of Mitron Inc. (established in 1996) and Co-Founder of Micable Inc. (established in 2006), with over 30 years of experience in microwave and RF engineering.

He received his Bachelor’s degree from the University of Electronic Science and Technology of China (UESTC) in 1988. He began his career at the Southwest Research Institute of Electronics Equipment and was a founding member of China’s National EW Key Laboratory, later serving as Manager of the Microwave and RF Division at CASIX, the first China–U.S. high-tech joint venture.

Since 1996, Mr. Liu has led the development of high-performance microwave components and cable assemblies, establishing strong partnerships with leading global RF and microwave companies.

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