Technical Education Webinar Series

Title: Space-saving and Cost-effective Chip Attenuators with Excellent Broadband Performance and High Power-to-size Ratio

Date: April 7, 2022

Time: 8am PT / 11am ET

Sponsored by: RFMW and Smiths Interconnect

Presented by: Dave Raymond, Global Product Manager Board Level Devices, Fiber Optics and RF Components and Tim Meehan, Technical Application Engineer Resistive/Cables, Fiber Optics and RF Components

Abstract:
The acceleration of demand for communication and data transmission in the digital age is creating a huge market for broadband connectivity. Higher power ratings and broadband performance are needed to support a wide range of applications.

The new TSX Series is designed to offer excellent broadband performance up to 50GHz, while delivering increased power handling in a small 0604 surface mount package. It allows wider coverage than traditional components while providing optimized return loss for multiple frequency ranges. This allows the customer to use a single chip in multiple applications, reducing the Bill of Material (BOM) item count and consequently, the cost of ownership.

Presenter Bios:
Dave Raymond is Product Line Manager, Board Level Devices at Smiths Interconnect with responsibility over passive RF components including Thermopad®, Diamond RF Resistives™, Attenuators, Resistors, Terminations and HybriX™ signal processing components. In his 33 years of experience with Smiths he has covered different roles, and has spent the last 15 years supporting customers in the space, defense, medical, commercial communications, and industrial segments.

Tim Meehan has 25 years with Smiths Interconnect supporting passive RF components including Thermopad®, Diamond RF Resistives™, Attenuators, Terminations, and Cable Assemblies. He has served in multiple roles supporting customers working in the space, defense, medical, commercial communications, and industrial segments.