EDI CON Online

Title: Avoiding Board Fabrication Pitfalls in High Speed & RF Designs

Date: August 11, 2021

Time: 11:30am PT / 2:30pm ET

Presented by: Julie Ellis, Field Applications Engineering Manager, TTM Technologies, Inc.

Abstract:
Today’s fine-pitch components and high speed digital and RF designs often push the limits of material and circuit board fabrication capabilities. Creating stack-ups that meet both customer requirements and fabricator capabilities are sometimes like solving multiple-solution puzzles without knowing about all the pieces. This presentation will discuss misunderstood pieces and how things can go wrong when they are not put together correctly. Q&A will include Andy Cameron, Field Applications Engineer at TTM Technologies.

Presenter Bio:
Julie Ellis is a Field Applications Engineering Manager for TTM Technologies, the third largest circuit board fabricator in the world. She enjoys using technical expertise gained from years of personal experience, reinforced by TTM’s extensive global engineering team, to help her customers design circuit boards that are manufacturable, reliable, and as cost effective as possible.

Please note:
To register for other EDI CON Online signal integrity, power integrity and EMC/EMI related events, please visit the Signal Integrity Journal website.

By registering, you are agreeing to allow the data collected to be shared with Microwave Journal®, Signal Integrity Journal™, the speakers & the sponsors of this event. You may be contacted regarding the subject matter presented.

Platinum Sponsors