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Online Panel: Meeting the Component and Test Challenges of Wi-Fi 6E

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When

2/23/21 11:00 am to 2/23/21 12:00 pm EST

Event Description

Online Panel Series

Title: Online Panel: Meeting the Component and Test Challenges of Wi-Fi 6E

Date: February 23, 2021

Time: 8am PT / 11am ET

Sponsored by: Anritsu Company, APITech, LitePoint, a Teradyne Company, Rohde & Schwarz and Qorvo

This panel will address the challenges to device design and testing of Wi-Fi 6E devices. Experts from semiconductor device companies will address design challenges and solutions while test/measurement companies will address the testing challenges they are solving for verification of the devices that use higher frequencies and wider bandwidths.

Moderator: Phil Solis, Research Director, Connectivity and Smartphone Semiconductors, IDC
Panelist: Brian Davis, Market Development Manager, Anritsu Company
Panelist: Prakash Hari, Product Line Director, APITech
Panelist: Adam Smith, Director of Marketing, LitePoint, a Teradyne Company
Panelist: Joerg Koepp, Market Segment Wireless Communications, Rohde & Schwarz
Panelist: John Anderton, Director of Product Line Management, Wireless Connectivity BU, Qorvo

Panel Participant Bios:

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Phil Solis Research Director, Connectivity and Smartphone Semiconductors

Philip Solis is Research Director for IDC's Enabling Technologies team for wireless and mobile connectivity technologies and semiconductors, as well as the semiconductors inside smartphones. Mr. Solis' core research area includes the evolution of wireless connectivity technologies and semiconductors, including short-range wireless, Wi-Fi, LPWA, cellular, and 5G. The other part of his core research area is smartphone semiconductors, including the main processors, DSPs, baseband processors, and RF.

DavisAnritsu Company

Brian Davis, Market Development Manager

Brian has over 20 years of experience in the wireless communication industry holding various positions in engineering and management at Motorola, Ericsson, Qualcomm, Zyray Wireless and Broadcom. In his current position at Anritsu, Brian handles sales, business and market development for wireless test and measurement products for the Americas Sales Region, specializing in product lines for mobile (5G NR, 4G LTE, 3G/2G), IoT including WLAN & Bluetooth® and Signal Generators and Analyzers. Brian holds a B.S. degree in Computer Engineering from Michigan State University and an MBA from Colorado State University.

HariAPITech

Prakash Hari, Product Line Director

Prakash Hari is Product Line Director at APITech with 2 patents and over 14 years of results-oriented product experience in leading cross-functional teams to design, develop & launch wide range of innovative telecom products & managed services to fortune 500 clients globally. He has a master’s in electrical engineering from Penn State and MBA from Georgetown University.

SmithLitePoint, a Teradyne Company

Adam Smith, Director of Marketing

Adam Smith is the Director of Marketing at LitePoint and a 20-year veteran of the RF industry, with expertise in cellular and connectivity technologies. A member of the LitePoint team since 2012, Adam’s knowledge and experience has been instrumental in driving product strategy for LitePoint test solutions.

KoeppRohde & Schwarz

Joerg Koepp, Market Segment Wireless Communications

Joerg Koepp is a Market Segment Manager responsible for driving T&M business in the wireless device market at Rohde & Schwarz. Jörg has extensive experience in the telecommunications industry. Prior to joining Rohde & Schwarz, he worked as a system architect, project leader, and director of system engineering and technology manager at Siemens and Nokia Siemens Networks.

AndertonQorvo

John Anderton, Director of Product Line Management, Wireless Connectivity BU

John Anderton is the Director Product Line Management for the Wireless Connectivity Business Unit at Qorvo, delivering core RF solutions, innovation and product leadership in Wi-Fi and the IoT. John has an engineering background, with over 20 years’ experience in innovative and leading semiconductor and consumer electronics companies, including NEC, Nokia, and NXP. In 2010 John joined a new and exciting IoT startup: GreenPeak Technologies, now part of Qorvo, leading product teams to deliver the first waves of GreenPeak enabled low power connected devices.

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