New market demands create a strong connection between packaging & RF

RF electronics is currently experiencing strong growth, driven mostly by 5G requirements and connected devices. Examples of RF electronics include connectivity modules in smartphones and smartwatches, and radar for ADAS vehicles. These are growing systems requiring innovative packaging solutions which simultaneously address specifications for cost, form factor, and performance. Other challenges related to signal integrity and low power consumption are starting to be addressed by the industry, with new solutions on the way.

Innovation is needed for the design and materials used, thus pushing the supply chain to explore new developments and more complex business models. The diversity of RF components (power amplifier, filters, switches, antennas, etc.) requires the use of several levels of integration as well as different packaging platforms and interconnects (TSV, wirebond, etc.).

Intended topics for the RF Packaging Forum are:

• Package simulation and design for RF (20 – 120 GHz)
• Antenna-in-package / antenna-on-chip / antenna-on-substrate / antenna-on-board
• New materials and technologies for RF packaging
• Global developments affecting RF packaging technology

More information, full program and registration: https://www.i-micronews.com/event/power-and-rf-packaging-virtual-forums-by-yole-developpement-and-citc?utm_source=Partner&utm_medium=email&utm_campaign=MicrowaveJournal_CITC_YOLE_Q4-2020