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EDI CON China 2019

EDI CON China 2019


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4/1/19 to 4/3/19

Event Description

EDI CON China celebrates electronic design innovation, bringing together RF, microwave, EMC/EMI and high speed digital design engineers and system integrators for networking, training, and learning opportunities.

Attendees come to EDI CON to find solutions, products and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace and medical industries.

Drawing attendees working on analog and digital designs, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges.

The exhibition hall features product displays, demonstrations, networking opportunities and poster sessions that address all aspects of design, simulation, test and verification.

CALL FOR PAPERS Submission Deadline: Thursday, January 10, 2019