EDI CON USA is the first industry event in the USA to bring together RF, microwave, EMC/EMI and high speed digital design engineers and system integrators for networking, product demonstrations, training and learning opportunities. Got a design challenge? Bring it to EDI CON USA and ask your peers and industry experts about it. Chances are, you’ll come away with an entirely new perspective on the problem, and some immediate ways to move forward.
The EDI CON USA exhibition and conference cover what you need to know: wireless, 5G, IoT, backplane, power integrity, signal integrity, modeling, measurement, radar, autonomous vehicles, sensors, interference, shielding, spectrum control, simulation, verification and more.
EDI CON is backed by the editorial excellence of the best publications in their fields: Microwave Journal and Signal Integrity Journal. Bringing technical expertise to the desktop, these publications delve into the most technical design challenges that practicing engineers face every day. See it all come to life at EDI CON USA 2018, the only industry event for RF & microwave engineers in the continental U.S. in 2018, and the biggest high speed design conference on the West Coast. Mark your calendar now for October 17-18 in Santa Clara, Calif., for this don’t miss event!