ROG Blog

The Rog Blog is contributed by John Coonrod and various other experts from Rogers Corporation, providing technical advice and information about RF/microwave materials.
3D Printing

3D-Print Antennas with Printable Dielectric Resin

Creating electronic components and circuits with three-dimensional (3D) printers holds great promise for high-frequency-analog and high-speed-digital (HSD) devices. With the right printable electronic materials, 3D printing can form fine feature sizes needed for new levels of dielectric component performance. 

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Dk Testing is Vital to mmWave Circuit Design

Dielectric constant is an important starting point for many circuit designers, whether specifying a printed circuit board (PCB) material for a design or with a material in hand and using its Dk in computer circuit simulations. Especially at higher, mmWave frequencies where wavelengths are short and circuit dimensions must be precise, according to a substrate’s Dk, the accuracy of a circuit material’s Dk can impact the success of a prototype. Learn how to determine it accurately.

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Featured Image

Concerning PCBs and the Transition from Microwaves to Millimeter Waves

As readers learned in the first part of this two-part ROG blog,1 printed circuit boards (PCBs) can be made for millimeter-wave frequencies by considering circuit-material characteristics when making the transition upward from microwave to millimeter-wave circuits. This second part of the blog explores how different circuit technologies often used at microwave frequencies and different circuit materials handle higher-frequency, millimeter-wave circuits.

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How to Transition from Designing for Microwave Frequencies to Millimeter-Wave Frequencies

Higher frequency PCBs require a thoughtful choice of circuit materials well suited for millimeter-wave frequencies and circuit fabrication processes that support those higher frequencies. Part 1 of this blog will explore circuit material characteristics that make them best suited for millimeter-wave frequencies. Part 2 will examine high frequency structures and the fabrication processes that can help them do best at millimeter-wave frequencies.

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Bonding Materials Minimize Loss in Multilayer Millimeter-Wave PCBs

As the demand grows for circuits serving available frequency spectrum in the mmWave range, circuit designers are meeting those demands using newer low loss circuit materials or hybrid circuits composed of multiple layers of dissimilar circuit materials, such as very low loss circuit materials for higher-speed, higher-frequency circuits and more cost effective circuit materials such as FR-4 for functions such as ground planes, power planes, and control lines not requiring such low loss circuit material.

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Thoughtful Material Choices Can Help Shrink RF Circuits

Smaller is often wiser in this age of electronic mobility and portability, and the choice of circuit material when starting a design has much to do with attempts to create smaller RF and microwave circuits. Circuit materials with higher dielectric constant (Dk) typically yield circuits with smaller features and dimensions for a given frequency range. But the higher Dk values can also result in increased insertion loss and other performance tradeoffs. The Dk value of a circuit material will also impact such circuit parameters as radiation loss, dispersion, and coupling.

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ROG 10 Years

Ten Years of Blogging on Microwave Journal’s Website

10 Years of the ROG Blog and It May Just Be the Start

Ten years ago, when we started the ROG Blog with the help of Microwave Journal’s dedicated editorial staff, it might have seemed impossible to keep a regularly scheduled blog on circuit materials going for even a few years, let alone for 10, without undue repetition. But the continued interest in the ROG Blog from our readers—thank you, folks—and the ever-improving quality of the circuit materials that we are writing about has “fueled the fire” and given us much to write about.

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Make Practical Use of GCPW at mmWaves

Successful application of GCPW technology involves understanding how the performance levels from fabricated PCBs can differ from the near-ideal performance levels predicted for GCPW circuit designs by commercial computer-aided engineering (CAE) software tools. A few factors can lead to differences between what the software predicts and what is achieved by a GCPW circuit, especially for mmWave circuit designs at high volumes.

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