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A Germany-based consortium of seven partners from industry and research is now offering an alternative solution to integrating sensor circuits on application specific integrated circuits (ASICs) via a research project for radar sensors for industrial and process measurement technology, titled "Glass interposer technology for highly compact electronic systems for high frequency applications" (GlaRA).

Find out which articles, products and educational topics were visited the most in 2020.

5G will reshape consumer electronics RF front-ends, but not only that. After improving mobile broadband experience on smartphones and connecting the unconnected on a broadband network (through FWA for example), network operators intend to extend their business footprint across other market verticals, including industrial automation and automotive connectivity. These new business opportunities are becoming addressable thanks to the coverage and implementation work done through consumer 5G today.

Teledyne e2v has further underlined its commitment to revolutionizing RF systems by successfully demonstrating next-generation data converter technology that its engineering team is currently in the process of testing. 

The Antenna Company has developed a Wi-Fi 6E MIMO antenna system, designed to increase network capacity, extend range and reduce latency in enterprise and industrial IoT networks.

Teledyne e2v is sampling beta versions of its EV12DD700 dual-channel DACs. These wide output bandwidth 12- or 8-bit data converters handle sample rates to 12 GSPS, providing the capability to generate signal waveforms in multiple frequency bands and first to operate within Ka-Band.

STMicroelectronics announced the acquisition of a French fabless company, SOMOS Semiconductor (SOMOS), specialized in RF power amplifiers (PAs) and RF front-end modules (FEM) based on the mainstream complementary metal-oxide semiconductor (CMOS) technology.

In light of the global pandemic, growing numbers of cases in Europe, and related measures imposed by the respective authorities, European Microwave Week (EuMW) organizers have decided to make EuMW 2020 a virtual event this year while simultaneously planning for the next in-person event in London in October of 2021.

Qorvo® has been selected by the U.S. government to create a state-of-the-art heterogeneous integrated packaging (SHIP) production and prototyping center for RF assemblies, a program valued at $75 million.