Industrial/Scientific/Medical Channel

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Huber+Suhner Group has adopted a new, very shareholder-friendly dividend policy and nominated a new CEO.

Anritsu Co. announces it is a founding member of the Open Lab Alliance (OLA), a collaboration of industry leaders with the common goal of advancing connected vehicle and autonomous vehicle technologies. The OLA was officially launched during a grand opening ceremony at the CETECOM laboratory in Milpitas, Calif.on February 12, 2016.

Anritsu Corp.’s MT8820C Radio Communication Analyzer now integrates with both DASY6 and cSAR3D from Schmid & Partner Engineering AG to provide seamless Specific Absorption Rate compliance testing.

e2v has strengthened its investment in high performance electronic solutions with the acquisition of Swedish signal processing design and development company, Signal Processing (SP) Devices.

Würth Elektronik iBE has acquired the Büchele Group, which further strengthens the company’s position as a market and technology leader in the automotive sector.

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced a new high power monolithic microwave surface mount (MMSM) series-shunt SP2T PIN diode reflective switch, the MPS2R10-606.

Fairview Microwave Inc., a supplier of on-demand microwave and RF components, announces a brand new line of high-reliability SPDT surface mount electromechanical RF switches that cover broadband frequencies from DC to 8 GHz. These new RF switches offer exceptional reliability and repeatable performance which make them an ideal solution for demanding industries and applications related to aerospace, defense, industrial, telecom, instrumentation, medical devices and many others.

Finmeccanica Security & Information Systems Division has signed a contract to replace the old air traffic control radars at 12 major Canadian airports including Toronto, Montreal, Ottawa, Vancouver and Calgary.

Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.

Zentech Manufacturing is pleased to announce that Greg Rodgers has joined the Zentech Manufacturing Inc. team as director, business development/Delaware Valley Region.