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Electromagnetic Professional (EMPro), is Agilent's new design platform for analyzing the electromagnetic effects of RF and microwave components such as high-speed IC packages, antennas, on-chip and off-chip embedded passives, and PCB interconnects.
NI's suite of software-defined instrumentation enables engineers to perform many RF measurements 5× to 10× faster than traditional boxes. With the RF list mode feature, customers can program their instruments to deterministically step through pre-configured list of frequencies and RF power levels.
Skyworks introduces two new varactor diodes for use in diverse applications such as mobile handset- based DTV receivers, FM tuners and low phase noise voltage-controlled oscillators.
Mician's µWave Wizard™ EM CAD tool is a fast and accurate electromagnetic solver that utilizes the well-known Mode-Matching technique and its derivatives (e.g. Boundary-Contour-Mode-Matching) as well as the flexible 2D FE- and 3D FE-Method.
Arlon’s EP2 (Enhanced Polyimide) represents a significant breakthrough in polyimide technology, using proprietary chemistry to provide a highly filled, dimensionally stabilized product with improved copper peel strength and higher thermal conductivity - at a reduction in cost that narrows the gap between pure polyimides and lower cost, but thermally inferior, multifunctional epoxies.
Cascade Microtech's two products streamline engineering and production testing of high-bandwidth, short-range RFIC devices for WirelessHD™, automotive radar, and other 60 GHz wireless applications.
Arlon’s EP2 (Enhanced Polyimide) represents a significant breakthrough in polyimide technology, using proprietary chemistry to provide a highly filled, dimensionally stabilized product with improved copper peel strength and higher thermal conductivity - at a reduction in cost that narrows the gap between pure polyimides and lower cost, but thermally inferior, multifunctional epoxies.
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Electromagnetic Professional (EMPro), is Agilent's new design platform for analyzing the electromagnetic effects of RF and microwave components such as high-speed IC packages, antennas, on-chip and off-chip embedded passives, and PCB interconnects.
