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The market value for GaAs revenues, driven by smartphones and consumer adoption of data-intensive applications, has grown strongly from the lows it struggled for in early 2009. The recently published Strategy Analytics GaAs and Compound Semiconductors (GaAs) report, “GaAs Device Vendor Market Share 2009: North America,” reports that this...

Alereon Inc. announced the addition of several new wireless HDMI reference designs to the company’s UWB wireless solution offerings: The AL5750 1080p Wireless UWB Audio/Video Adapter, the AL5810/11 Wireless HDMI Encoder/Decoder and the AL5820/21 Wireless HDMI Encoder/Decoder with 3D support. All reference designs are powered by Alereon’s ECMA and...

As worldwide mobile phones sales begin to rebound after the economic downturn, emerging economies will fuel demand for entry-level handsets, a new ABI Research report finds. Shipments of ultra-low-cost handsets will grow to more than 360 million by 2015, representing a 2010-2015 CAGR of over 22 percent, while shipments...

Logic PD and Roke Manor Research have announced a strategic partnership whereby the companies will develop wireless products that maximise the user experience and offer customers the shortest development times possible. They will share their product development expertise and intellectual property across geographies to offer customers advanced solutions that...

NEC Corp. will participate in an LTE field trial with Telefonica Moviles Argentina S.A. , the largest mobile carrier in Argentina, and a subsidiary of mobile giant Telefonica. The trial, which is the first in the AWS band in Central and South America, is taking place between November and...

Richardson Electronics Ltd. announced that it has once again teamed with Scintera® Inc. to bring the newly enhanced SC1887-03 Adaptive RF Power Amplifier Linearizer (RFPAL) to the UHF broadcast TV transmitter market. This fully adaptive, “RF-in, RF-out” amplifier pre-distortion solution operates directly at the carrier frequency, and requires only...

Innovative Micro Technology Inc. (IMT) announced the addition of a new geometry point in its technology roadmap for Through Silicon Vias (TSV). Joining the copper-filled 15 by 60 micron depth TSV configuration that has been in production for nearly two years, IMT has been sampling its 50 by 250...

Capital expenditure on mobile backhaul varies greatly by region and by technology. While most countries face similar current or future struggles to reduce network congestion, the solutions being adopted differ according to existing infrastructure, network generations, and government mandates and incentives. One major division is whether to use optic...

The International Telecommunication Union (ITU) World Radiocommunication Seminar 2010 (WRS-10) opened in Geneva on 6 December to discuss international regulations on the use of radio frequency spectrum and satellite orbits. Discussions during the week will also focus on some key technological issues, such as future standards for mobile phones....