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STMicroelectronics announced that its Teseo II single-chip satellite-tracking ICs were successful in the first ground location test using Europe’s Galileo navigation system.
Lime Microsystems has signed a deal with Interlligent RF & MW Solutions to use the company's latest test and measurement technology in the development of its FPRF transceiver ICs.
Renesas Electronics Europe, supplier of advanced semiconductor solutions, has launched an expanded drive to build sales in Russia and other CIS countries.
Tensilica® Inc. has strengthened its strategic relationship with Huawei with the announcement that HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s Dataplane Processor Units.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced it has shipped three billion MEMS sensors to date.
STMicroelectronics has been awarded the prestigious 2012 Corporate Award from the IEEE Standards Association) in recognition of its advancement of standards in electrical and electronics engineering.
e2v aerospace and defense, Inc. announced that qualification has been completed and production units have been shipped on the first device in the MaximTMLife Extension Program, the DG406AK/883B.
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STMicroelectronics announced that its Teseo II single-chip satellite-tracking ICs were successful in the first ground location test using Europe’s Galileo navigation system.