Antennas

TECOM and QEST Join Forces

TECOM Industries , a Smiths Interconnect company that is part of the global technology business Smiths Group, and German antenna developer QEST Quantenelektronische Systeme GmbH announced a teaming agreement to jointly produce and market airborne broadband antennas for in-flight connectivity. In response to the growing market demand, the partnership...
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STMicroelectronics to Sponsor EMPC 2009

STMicroelectronics , one of the world’s largest semiconductor manufacturers and a world leader in MEMS and power ICs, is to be the principal sponsor of the 17 th European Microelectronics and Packaging Conference & Exhibition (EMPC 2009). The company will work with the organizer, the Italian chapter of the...
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ITU Invitation to Marconi Celebration

According to the story told in 1968 by a senior citizen of Salvan, in 1895 Guglielmo Marconi carried out some of his earliest wireless experiments in the vicinity of this picturesque village of the Swiss Alps. The IEEE duly acknowledged this event, and granted a “Historical Milestone in Electrical...
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Canadian-based COM DEV to Open First US Office

COM DEV International , a global designer and manufacturer of space hardware subsystems, has gone against the trend of companies outsourcing their skilled workforce to other states and countries by opening a new state-of-the-art engineering and production facility in El Segundo, CA. "We are tremendously excited to have the...
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