RF & Microwave Industry News

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Infineon Technologies introduced the AIROC™ ACW741x, a new product family that integrates a tri-radio with Wi-Fi 7, Bluetooth® LE 6.0 with channel sounding and IEEE 802.15.4 Thread, with Matter ecosystem support in a single device. 

Due to strong interest and demand for Insight SIP's recently launched ISP2454-LX module, the company announced they will offer three variants to meet differing use case requirements. 

The E320 is the latest edition to the Pixus line of ruggedized Ettus/NI software defined radios (SDRs). 

Amphenol RF announced the expansion of their cable assembly portfolio with MCX straight and right-angle plug configurations that feature rugged IP67 bulkhead SMA, TNC, RP-TNC and N-Type straight jacks.

Broadcom Inc. announced the launch of its next-generation BCM4918 accelerated processing unit (APU) and two new dual-band Wi-Fi 8 devices, the BCM6714 and BCM6719.

The Wireless Broadband Alliance (WBA) has shared its 10 predictions for Wi-Fi in 2026 and beyond.

The IEEE Electronic Components and Technology Conference (ECTC) has extended the deadline for the Student Innovation Challenge for ECTC 2026.  

YINCAE Advanced Materials will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026, in San Francisco, Calif., USA.

The Z-Wave Alliance announced the continued expansion of Z-Wave Long Range (ZWLR) certification across the ecosystem.