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TECHNICAL FEATURES Extending Gold Thick-film Technology through Materials and Process Development Meg Tredinnick and David Malanga Heraeus Inc., Circuit Materials Division West Conshohocken, PA New powder and screen technologies have allowed for the development of a thick-film gold paste that meets a difficult list of requirements. This new Au...

TECHNICAL FEATURES Time Domain Analysis of a Printed Circuit Board Via Brock J. LaMeres Agilent Technologies Colorado Springs, CO T.S. Kalkur University of Colorado, Department of Electrical and Computer Engineering Colorado Springs, CO This article describes the time domain analysis of a printed circuit board via connecting two semi-infinitely-long...

TECHNICAL FEATURES Finite Element Analysis of RF Couplers With Sliced Coaxial Cable N. Benahmed and M. Feham University of Tlemcen, Department of Electronic Tlemcen, Algeria This article presents the analysis of two coupled lines with sliced coaxial cable, based on a numerical resolution of the Laplace's equation by the...

TECHNICAL FEATURES A Dynamic Drain Current Model for MESFET/HEMTs Valid Under Varying Static Bias and Temperature Conditions J.M. Cairon, A. Tazon, T. Fernandez, C. Navarro and A. Mediavilla University of Cantabria Cantabria, Spain J. Rodriguez-Tellez University of Bradford West Yorkshire, UK Modifications to the Dortu-Muller DC drain current model...

TECHNICAL FEATURES Design Considerations for Thick-film High Power Chip Terminations Robert Grossbach American Technical Ceramics Huntington Station, NY A s the wireless revolution extends component requirements upward in frequency, higher in operating power and smaller in size, the performance demands on surface-mount devices grow ever more stringent. Chip terminations...

TECHNICAL NOTES Shielding Formulas for Near Fields R.C. Hansen Consulting Engineer Tarzana, CA This article reviews extremely low frequency (ELF) formulas for magnetic shielding effectiveness. In particular, the simple three-term Schelkunoff formula is accurate at all frequencies if the proper near-field, or far-field, wave impedance is used. E lectromagnetic...

NEW PRODUCTS COMPONENTS *           Power Splitters The models PD22-73 power divider and HY22-73 90° hybrid are designed for the 2.1 to 2.3 GHz ISM band. The 50 W components offer low loss, high isolation and good phase/amplitude balance. The monolithic circuitry is 100 percent passive and available in...

AROUND THE CIRCUIT INDUSTRY NEWS *          Spacek Labs Inc. , Santa Barbara, CA, has completed its acquisition of the assets of millimeter-wave amplifier manufacturer Sierra Wireless Systems . Financial terms of the cash agreement were not disclosed. *          Gel-Pak , ® Sunnyvale, CA, has acquired Silicon Packaging Technology Inc....

NEW LITERATURE *          Product Brochure This six-page brochure describes integrated assemblies, converter assemblies, log components, log IFs, components, filter banks and switch filter banks. Product photographs are provided. Descriptions of the company's manufacturing and engineering processes are included, as well as a company mission statement. AKON, San Jose, CA...

NEWS FROM WASHINGTON Common Ground Station Approved for Full-rate Production T he Department of Defense (DoD) has approved full-rate production that will extend the acquisition program for the Motorola US Army Common Ground Station (CGS), a battlefield intelligence and reconnaissance ground processing system. The integrated, multi-workstation CGS is assigned...