Articles Tagged with ''infrastructure''

Aeroflex introduces one-box LTE-A base station tester

Aeroflex Ltd., a wholly owned subsidiary of Aeroflex Holding Corp., has launched an extended version of its TM500 industry-standard base station tester capable of emulating several thousand LTE user equipments (UE), fading channel models, and LTE-A carrier aggregation functionality in a one-box benchtop unit. The TM500 Test Mobile delivers more leading edge LTE-A development capability with a higher UE density than any other solution on the market.


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Skyworks secures hi-rel designs with multiple A&D manufacturers

Skyworks Solutions Inc. an innovator of high performance analog semiconductors enabling a broad range of end markets, announced that is has captured high-reliability (hi-rel) and commercial-off-the-shelf (COTS) sockets with several aerospace and defense suppliers such as Cobham, EADS, Herley and Teledyne.  Skyworks’ solutions are being leveraged for microwave switching, attenuation, receiver protection and mixer and detector applications in commercial and military radios, avionics systems, software defined radios and navigation platforms that support major tier-one aerospace and defense companies such as Boeing, L-3 Communications, Northrup Grumman and Raytheon.


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Mindspeed to sell assets of its wireless infrastructure unit to Intel

Mindspeed Technologies Inc., a leading supplier of semiconductor solutions for network infrastructure, announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corp. The asset sale was contemplated by the agreement and plan of merger with M/A-COM Technology Solutions Holdings Inc., announced on November 5, 2013.


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RFHIC joins EDI CON 2014 as a Gold sponsor

Leading GaN-based RF power amplifier manufacturer will share its expertise in wideband, high performance devices with Chinese designers and wireless infrastructure system integrators

Horizon House Publications and Microwave Journal China announced the participation of RFHIC, a global leader in the design and manufacture of RF & Microwave components, as a Gold sponsor of the 2014 Electronic Design Innovation Conference (EDI CON 2014) to be held April 8–10, 2014 at the Beijing International Convention Center in Beijing, China.


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