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NXP Semiconductors announced that it has signed a memorandum of understanding with Hon Hai Technology Group (Foxconn) to jointly develop platforms for a new generation of smart connected vehicles.
Ford’s new fully networked vehicle architecture implements NXP’s vehicle networking processors and the i.MX 8 Series processors, working together to upgrade vehicles that help improve customer lifestyle and streamline the ownership experience.
NXP Semiconductors announced that its Trimension ultra-wideband platform now offers fine ranging for new tagging use cases, UWB and Bluetooth® Low Energy solutions have been combined to deliver spatial awareness to the new Samsung Galaxy SmartTag+.