This eBook addresses some of the challenges and best practices when designing and fabricating PCBs for RF applications. The first article gives a good overview of the fabrication process for a variety of different multilayer printed circuit boards. The second article provides insight into the reality of PCB fabrication versus the ideal models and how those differences become more important as circuits go higher in frequency. Article three acknowledges that these PCBs will operate at elevated temperatures, and it provides insight into the failure mechanisms, test methods and proper selection of substrate materials to optimize temperature performance. The fourth article provides good technical details about how to select the proper circuit board dielectric mate-rial as applications go higher in frequency. The final two articles address the finer points of the board design and manufacturing process for a microwave power amplifier and a microwave/millimeter wave patch antenna.

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