The University of Alberta’s NanoFab has selected SUSS MicroTec’s new ELAN CB6L wafer bonding equipment for its research and production activities. The NanoFab is an open access micro and nano fabrication facility, which is currently being used by over 130 research groups from the university, other Canadian universities and industry. The manual bonder will be used in nanotechnology research, RF MEMS switches for wireless applications and pressure sensors for the oil industry.

The NanoFab boasts an equipment set worth more than $20 M and its director, Ken Westra, who has over 20 years experience in MEMS fabrication, thin films, and microfabrication in both industry and academia, commented, “The micro and nano fabrication equipment in our facility is virtually unequalled in Canada. We are pleased to invest in the SUSS bonder as part of our strategy to provide the latest MEMS process technologies to our research partners.”

“The University of Alberta is one of the best microfabrication research labs in North America,” said Michael Kipp, president, Wafer Bonder Division, SUSS MicroTec, USA. “We are pleased that they have chosen the ELAN bonder to support process advances at the R&D level. In addition, researchers using the NanoFab will benefit from the ability to easily transfer technology developed on the ELAN bonder to any SUSS production wafer bonding system.”