Averatek Corporation has announced its participation in this year’s JPCA Show Exhibition and NPI Presentation in booth 5F-21, being held June 15 to 17 at the Big Sight center in Tokyo, Japan.
Averatek will be presenting advanced HDI PCB and package substrate manufacturing technology Averatek Semi-Additive Process (A-SAP™) and associated new materials Aluminum Clad Laminate (ACL™) and Catalyzed Build-up Film (CBF™). Averatek will also jointly present with Toyo Aluminum K.K. (Toyo) about a new catalyzed aluminum foil (Ranafoil™) for A-SAP™ during the show. A-SAP™ and these new materials enable for filling the technical gap between mSAP HDI PCB and the package substrates—and dramatically expand material selection flexibility in package substrate manufacturing.
Averatek will first present on Friday, June 17, at the NPI presentation. Toyo will have a presentation on the same day at the NPI presentation. Both companies will share booth #5F-21 during the show.
A-SAP™ can be used for a variety of materials with very thin electroless base copper layer—unlike other SAPs. The palladium catalyst is formed by Liquid Metal Ink™ (LMI™), which allows for less than 10 nanometer of uniform metal coating with A-SAP™.
ACL™ and CBF™ use a catalyzed aluminum foil by Toyo which provides well-controlled surface texture for the process, and very uniformly coated palladium metal. Developed for outer and build-up layers, now ACL™ and CBF™ enhance the use of A-SAP™.