W. L. Gore & Associates (Gore) will be showcasing the new GORE® PHASEFLEX® Microwave/RF Test Assemblies, Type 0N for High Density Test/Interconnection at IMS2017, June 6-8, at the Hawaii Convention Center, Honolulu, Booth #1740.

High-density and modular test instruments for wireless devices and aerospace systems have become increasingly complex, with a larger number of ports that can accept up to 32 test assemblies or more. They’re also subjected to constant flexing during calibration and testing DUTs (Device Under Test) that can compromise phase and amplitude stability, resulting in inaccurate measurements. As such, test assemblies need to be smaller, lighter weight and more flexible for easy routing in less space when connecting them to Vector Network Analyzers (VNAs), like ENA and PXIe. At the same time, they need to deliver highly accurate measurements for faster throughput, less calibration and downtime and reduced overall costs.

To address these demanding requirements, Gore has introduced GORE® PHASEFLEX® Microwave/RF Test Assemblies, Type 0N–the smallest, lightest, most internally ruggedized assembly on the market today for modular, multi-port and multi-site test applications. Gore’s high-density test assemblies ensure consistent, repeatable measurements with stable electrical performance up to 50 GHz.

Extremely durable and highly stable performance over time

Building on the portfolio of GORE® PHASEFLEX® Microwave/RF Test Assemblies, the unprecedented small package and light weight of Type 0N not only makes initial routing much easier in cramped spaces but also reduces the stress on test ports and DUTs as cables are connected to test instrument ports and fixtures. This high density test assembly also withstands continuous movement and flexing while delivering enhanced phase and amplitude stability.

Increased test efficiency, reduced test cost

Connecting the new GORE® PHASEFLEX® Microwave/RF Test Assemblies, Type 0N to a test application eases calibration and troubleshooting, improves test results, speeds throughput, increases service life and reduces overall costs. This new assembly solution from Gore offers stable electrical performance and durable mechanical protection over time in a compact, cost-effective package.

The combination of protection and performance coupled with reduced size and weight makes the new GORE® PHASEFLEX® Microwave/RF Test Assemblies, Type 0N ideal for modular, multi-port and multi-site test applications such as:

  • 5G test and interconnection,
  • Component/device R&D and production test,
  • High-speed digital test devices/assemblies,
  • Modular test instruments such as PXIe and AXIe,
  • RF switches.

For more information, see Gore at IMS2017 at Booth #1740, or visit gore.com/electronics.