Items Tagged with 'companies'

TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course in Boston, May 7-9th.

New research conducted by IDTechEx, and published in the report "RFID Forecasts, Players and Opportunities 2014-2024," finds that the RFID market - including tags, readers, software and services, for passive and active RFID - will grow from $7.88 billion in 2013 to $9.2 billion in 2014. Most growth is due to active RFID/RTLS systems, interrogators, and then tags, in terms of total money spent.

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 

RFMW Ltd. announced that Tom Butler has joined their organization as director of sales for North America. Butler has served in senior management positions where he has directed sales at local, national and international levels.

Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.

The Boeing Co. and Lockheed Martin Corp. are teaming to compete for the United States Air Force’s Long-Range Strike Bomber program, with Boeing acting as the prime contractor and Lockheed Martin as the primary teammate.

There are many companies that contribute to 3GPP technologies, including WCDMA/HSPA, LTE, and the EPC; however, only a handful of companies stand out across the board. ABI Research looked at the number of chairmanships, rapporteurships, overall contributions, approved contributions, and discussion papers for 3GPP standards. This was done for RAN1, RAN2, RAN3, RAN4, RAN5, SA1, SA2, SA3, SA4, SA5, CT1, CT3, and CT4 from 2009 through 2012.

EDI CON 2013 - High-frequency electronic design engineers converged for learning and networking opportunities in Beijing. The event drew in excess of 2,000 attendees including over 1,100 unique conference delegates, over 800 visitors and exhibitors and more than 30 members of the press.