Industry News

Tough Times for Discrete Power Semiconductor Manufacturers

Economic downturn and inventory building have produced manufacturers in the highly competitive discrete power semiconductor market who are severely restrained by low prices and will continue to face difficulty in generating sustainable profits. A new analysis from Frost and Sullivan, “World Discrete Power Semiconductor Markets,” reveals that revenues in...
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Thermally Stable PCB Material

A new printed circuit board material has been developed to meet the demanding requirements for dielectric constant temperature stability and plated hole reliability for high temperature and varying environmental conditions. TSM-30 is based on a high temperature, low loss organic combined with ceramic. The material exhibits superior low loss,...
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A Magnetic MEMS-based RF Relay

Micro-electromechanical systems (MEMS)-based products run from the mundane of automobile air-bag sensors to the over-hyped optical switching fabrics of the recent telecommunications bubble. For some time now, design engineers have been waiting for the advantages of MEMS fabrication techniques to be successfully applied to the problem of RF and...
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From Design to Reality

Development speed is a major concern in today's products' life cycle. Ranking alongside the raw costs involved with prototyping a device, time-to-market is the one key constraint imposed on design engineers. Consequently, any innovative or competitive advantage can easily be lost if advanced ideas get stuck in a long...
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Design of a 900/1800 MHz Dual-band LTCC Chip Antenna for Mobile Communications Applications

This article presents the design simulation, implementation and measurement of a miniaturized 900/1800 MHz dual-band low temperature co-fired ceramic (LTCC) chip antenna for mobile communication applications. The use of a helix-monopole type dual-band ...
Recently, multi-layer LTCC technology has been used extensively for the miniaturization of RF passive components and antennas. In addition to the high integration by embedding components and interconnects, high Q passive elements have been demonstrated with LTCC technology. 1 It is suitable to integrate antennas and other passive components,...
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