RF & Microwave Industry News

UltraSource releases new thin film microcircuit CopperVia

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.


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RFMD unveiled highly-integrated FEM for smart energy/AMI applications

RF Micro Devices Inc. unveiled a highly-integrated front end module (FEM) for Smart Energy/Advanced Metering Infrastructure (AMI) applications at the 2013 Consumer Electronics Show (CES) in Las Vegas. RFMD’s single-chip RFFM6403 FEM delivers industry-leading performance, reduces customer design time and speeds customer time-to-market in Smart Energy/AMI applications operating in the 405 to 475 MHz frequency range, as well as for portable battery powered equipment and general 433/470 MHz ISM band systems.


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