RF & Microwave Industry News

Kulicke & Soffa Closes Purchase of Alphasem

Kulicke & Soffa Industries Inc. closed the previously announced purchase of Alphasem, a supplier of die bonder equipment, from Dover Technologies International Inc., a subsidiary of Dover Corp. The purchase price was $27.1 M in cash, after a working capital adjustment and subject to further post closing adjustments. "We...
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Keithley and Mesatronic Enter Agreement

Keithley Instruments Inc. , a leader in solutions for emerging measurement needs, announced it has partnered with Mesatronic Group , Voiron, France, to develop advanced probe cards for semiconductor parametric testers used in RF and low current DC applications. William Merkel, marketing director for the Keithley Parametric Test Product...
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WiMedia UWB PHY Design and Testing

New wireless networking standards commonly present design challenges in the physical layer, which in turn present circuit simulation and testing challenges. The WiMedia MB-OFDM UWB signal with its low power, hopped, 528 MHz wide OFDM format is a curren...
With the blessing of the WiMedia Alliance, the stage is set for widespread implementation of certified wireless USB and next-generation Bluetooth 3.0 products, using multi-band orthogonal division modulation (MB-OFDM)-based ultra-wideband (UWB) physical layer (PHY). Wireless USB supports data rates of 53.3, 80, 106.7, 160, 200, 320, 400 and 480...
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Complete RFIC Design Flow Targeting Next Generation Wireless Front-ends

Besides the circuit design itself, a complete design flow based on a prescribed methodology is crucial for a successful implementation of next generation wireless front-ends. An integral part of this process is a scalable front-to-back solution that no...
The demand on mobile communications has grown over recent years. Today’s mobile communication systems use sophisticated signal processing to achieve high transmission rates. The challenges for the next generation wireless systems will increase even further, when designs will need to meet multi-standards and achieve reconfigurability. Evaluations of various integration...
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HSPA: New Challenges for Power Amplifiers in UMTS User Equipment

Mobile radio technology, based on the universal mobile telecommunications system (UMTS), is developing at breakneck speed. Network operators worldwide are currently upgrading their networks with new high speed downlink packet access (HSDPA) technology, which optimizes the data transmission from the network to the user equipment (downlink). New transmission methods...
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Literature Showcase


Microwave Amplifier Brochure The Microwave Amplifier Brochure from AR Worldwide RF/Microwave Instrumentation features a wide range of microwave amplifiers. The brochure highlights the “S” and TWT amplifier series that covers 1 to 4000 W and 0.8 to 40 GHz and includes photographs, descriptions, specifications and performance graphs for each...
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Ask Harlan, November 13, 2006

Harlan Howe has 34 years experience as a microwave design engineer and fifteen as publisher and editor of Microwave Journal ® , and is an IEEE Fellow and past president of MTT-S. He's here to answer your questions on RF and Microwave engineering.
Published November 13, 2006 From: Hadi Ghazian, Tarbiat Modares University Dear Harlan, How can I calculate and measure the maximum power capacity of a cylindrical waveguide operating in the TE11 mode? Dear Hadi, The power handling of waveguides is a function of dimensions, surface finish, conductivity, dielectric strength of...
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Siemens Strengthens Presence in China

Over the next two years, Siemens will invest approximately €70 million in building a center for regional headquarters in Shanghai, China. Siemens Center Shanghai (SCS) will serve the eastern region of China and the aim is to consolidate all Shanghai-based Siemens business there by the end of 2008. More...
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