Industry News

STMicroelectronics and ACS Support VII Initiative

STMicroelectronics and Automotive Communications Systems (ACS) are to jointly develop communications integrated circuits for Vehicle and Infrastructure Integration (VII). The VII initiative is investigating the potential safety benefits of car-to-car and car-to-roadside high-speed communications. Contributors include the US Federal Government, state governments, the world’s leading car companies, suppliers, consultants...
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QinetiQ is a Good LISTENER

QinetiQ, as part of the KAIROS Consortium, which L-3 Communications leads and also includes LogicaCMG, has been awarded a share in a £1 M, 10-month UK MoD contract for the Assessment Phase of Project LISTENER, for risk reduction and solution definition. The Project integrates sensor products in order to...
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Around the Circuit

Industry News Theodore “Ted” L. Kozul died November 6 th , in his home after a long illness. He was 80 years old. Ted was the founder and president of Baytron Co., one of the first companies to offer a full line of millimeter-wave components. His products looked like...
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Strategy for RFID Validation and Verification Using Software-defined Instrumentation

The global market for radio frequency identification (RFID) continues to expand as the technology repeatedly demonstrates real benefits across multiple application areas at lower cost. To take full advantage of this growing market, companies continue to investigate ways to differentiate themselves through time to market, better performance and research...
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Printed Circuit Board Materials for Microwave Designs in Automotive Applications

In recent years, in the microwave industry once dominated by defense and aerospace, a market has expanded dramatically to embrace telecommunications and other high volume commercial applications. These changes have had a great influence on the developm...
Microwave laminates, or substrates, have been used in the industry for approximately 50 years. Although they can be thought of as the materials used in microwave printed circuit boards, they do far more than provide mechanical support for components and copper interconnections. In a real sense, these materials form...
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Design Enablement for RF and Microwave IC Design: Part I

This two-part series from Jazz Semiconductor presents recent developments in design support methodology from a pure-play wafer foundry specialized in RFCMOS and advanced CMOS technologies including BiCMOS, SiGe BiCMOS and high voltage CMOS. In part one...
The gigahertz era in consumer electronics has catalyzed the convergence of RF and microwave applications with mainstream large-scale semiconductor technology. This merging of technology has brought performance, manufacturability and time-to-market requirements into the forefront of a world once driven solely by design-to-specification. Stand-alone microwave circuits are rapidly moving to...
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