SPARK Microsystems and UWB Alliance have initiated a joint effort to test the coexistence and aggregation capabilities of UWB technology in environments where other UWB or other wireless protocols and radio devices are in use.
nScrypt’s research arm, Sciperio, has received US Patent no. 10,966,312, entitled “Printed Litz Line,” which has two independent claims and 12 dependent claims and covers a method of 3D printing a litz line.
The 68th annual IEEE International Electron Devices Meeting (IEDM), the leading forum for the unveiling of breakthroughs in transistors and related micro/nano technologies, will be held December 3-7, 2022 in San Francisco.
ATIS’ Next G Alliance released recommendations forecasting the technologies that will be needed to advance the 6G future and areas in which further research is required on North American 6G priorities, presented in "Next G Alliance Report: 6G Technologies."
EdgeCortix® Inc. announced a collaboration with Renesas Electronics Corporation where EdgeCortix has taken its heterogeneous platform-based compiler framework MERA and developed a new compiler, DRP-AI TVM for Renesas' DRP-AI1 accelerator.