RF & Microwave Industry News

WORKSHOPS & COURSES

WORKSHOPS & COURSES MEMS for Communications ­ From Concept to Product * Topics: The latest information on MEMS technology and applications in communications, with specific information on CoventorWare™ software products and intellectual property available from the company for rapid development and integration of MEMS into products. * Site: Schaumburg,...
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A MMIC Power Amplifier Package for OC-192 Applications

A wideband, medium power amplifier with automatic gain control for use as an AGC or laser modulator driver amplifier in OC-192 fiber optic systems
PRODUCT FEATURE A MMIC Power Amplifier Package for OC-192 Applications StratEdge San Diego, CA StratEdge was contracted by TriQuint Semiconductor, a manufacturer of GaAs MMIC components, for package, assembly and test services for one of their newest devices. The resulting product, a wideband, medium power amplifier (MPA) with automatic...
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A Linear LDMOS Amplifier for EDGE GSM Applications

Results of a class AB demonstration circuit using a BLF1820-70 LDMOS transistor
PRODUCT FEATURE A Linear LDMOS Amplifier for EDGE GSM Applications Philips Semiconductors Foxboro, MA Cellular infrastructure providers are ramping up plans to augment present GSM systems with a new Enhanced Data rate for GSM Evolution (EDGE) GSM system. This new format adds additional challenges to the design of the...
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An Automated Assembly Tool for Precision, High Speed RF Die-attach Applications

A new fully automatic assembly tool for high frequency RF power amplifier integrated circuits
PRODUCT FEATURE An Automated Assembly Tool for Precision, High Speed RF Die-attach Applications Palomar Technologies Vista, CA As telecommunications and information processing have exploded over the last 20 years, the need for extremely accurate, high yield microchip assembly solutions has shifted from a low volume aerospace and defense industry...
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Microwave Temperature Compensated Detector Design for Wide Dynamic Range Applications

Presentation of key design features necessary for a microwave temperature compensated detector
TUTORIAL Microwave Temperature Compensated Detector Design for Wide Dynamic Range Applications Fundamentals on RF detection, Schottky diode matching techniques, temperature compensation schemes and video output system configurations are reviewed. Germán Torregrosa-Penalva, Alberto Asensio-López, Jaime Lluch-Ladrón de Guevara and Francisco Javier Ortega-González Departamento de Señales, Sistemas y Radiocomunicaciones, E.T.S.I. Telecomunicación,...
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A Compact Capacitance Meter for High Speed Production Test

Introduction to a compact, highly accurate capacitance meter designed for high speed measurements
PRODUCT FEATURE A Compact Capacitance Meter for High Speed Production Test Agilent Technologies Santa Rosa, CA The Agilent 4288A capacitance meter is designed to perform high speed measurements of capacitance while taking up less room in an automated test equipment (ATE) system and providing a high level of accuracy....
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Broadband Solid-state Class A Power Amplifiers for 1 to 11 GHz Applications

Introduction to the highly functional and extremely flexible series 2000 boradband solid-state class A power amplifier
PRODUCT FEATURE Broadband Solid-state Class A Power Amplifiers for 1 to 11 GHz Applications Milmega Ltd. Isle of Wight, UK With microwave power amplifiers finding applications in such diverse and demanding fields as communications, medical systems, test equipment and the military market, functionality, adaptability and flexibility of design are...
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The Use of Uniplanar Technology to Reduce Microwave Circuit Size

Advantages of uniplanar technology in reducing microwave circuit size
TECHNICAL FEATURE The Use of Uniplanar Technology to Reduce Microwave Circuit Size This article addresses some of the unique advantages that uniplanar technology can offer the microwave circuit designer. In contrast to the conventional microstrip approach, uniplanar techniques allow a mixture of transmission line configurations to be used together,...
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Interconnects for a Multi-layer Three-dimensional Silicon Architecture

Development of lateral and vertical interconnects for K- through W-band applications using silicon micromachining
TECHNICAL FEATURE Interconnects for a Multi-layer Three-dimensional Silicon Architecture As low cost and low volume gain increasing importance in today's technology market, the development of lateral and vertical interconnects for K- through W-band applications using silicon micromachining is a worthwhile endeavor. Thus, lateral components appropriate for multi-layer applications, such...
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New Dielectric Bead for Millimeter-wave Coaxial Components

Introduction to a bead used for the dielectric structure for mechanical support of coaxial microwave components
TECHNICAL FEATURE New Dielectric Bead for Millimeter-wave Coaxial Components Rudy Fuks Astrolab Inc. Warren, NJ The bead discussed in this article represents the dielectric structure for mechanical support of coaxial microwave components. The main features of the bead are its electrical performance and mechanical ability to keep all parts...
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