RF & Microwave Industry News

UMC Shows Initiative for Low Power Design

Global semiconductor foundry UMC has joined the Power Forward Initiative (PFI), which is an industry initiative sponsored by Cadence Design Systems Inc.
Global semiconductor foundry UMC has joined the Power Forward Initiative (PFI), which is an industry initiative sponsored by Cadence Design Systems Inc. It has the goal of enabling the design and production of more power efficient electronic devices. The Initiative, made up of more than 20 industry-leading electronics companies,...
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Three-dimensional Restructuring at Huber + Suhner

In recent years Huber + Suhner has focused on the core business of ‘Electrical and Optical Connectivity’, and concentrated on the three areas of Radio Frequency, Fiberoptic and Low Frequency Technologies.
In recent years Huber + Suhner has focused on the core business of ‘Electrical and Optical Connectivity’, and concentrated on the three areas of Radio Frequency, Fiberoptic and Low Frequency Technologies. This approach has proven to be very successful and is the framework of further strategic development of the...
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Agilent's Test Solution Selected for All Silicon Image Test Centers

Agilent Technologies Inc. announced that its HDMI 1.3 Compliance Test Solution has been selected by Silicon Image Inc., a leader in storage, distribution and presentation of high-definition content, for use in all of its Authorized Test C...
Agilent Technologies Inc. announced that its HDMI 1.3 Compliance Test Solution has been selected by Silicon Image Inc. , a leader in storage, distribution and presentation of high-definition content, for use in all of its Authorized Test Centers (ATC). Agilent announced in January 2007 that Silicon Image had selected...
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STI Wins $4.7 M US Air Force Contract

Superconductor Technologies Inc. (STI), a provider of high performance infrastructure products for wireless voice and data applications, announced it was awarded a contract from the US Air Force to develop Semiconductor-Tuned High Temperature Superconducting Filters for Ultra-Sensitive Radio Frequency Receivers (SURF). The funded contract amount is $4.7 M. Upon...
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European Open House for ZigBee Alliance in Paris

The ZigBee® Alliance will hold its Fourth Annual European Open House and Exposition on May 3, 2007, in Paris, France. The one-day event features live demonstrations, panel discussions and lectures on how ZigBee, the global wireless language connecting dramatically different devices, is used in homes, commercial buildings and industrial...
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Infineon Expands R&D Operations in Singapore

Through investment of approximately €200 M, Infineon Technologies is expanding its Research & Development activities in Singapore, with the aim of being able to better serve the growing demand for products in the energy efficiency, connectivity and security areas. The center was established in 1991 and provides IC and...
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Auriga Measurement Systems Signs Accelonix Group

Auriga Measurement Systems LLC announced an exclusive agreement with Accelonix of Europe.
Auriga Measurement Systems LLC announced an exclusive agreement with Accelonix of Europe. Accelonix, a supplier of microelectronics capital equipment and services, will distribute Auriga’s product line in France, Portugal and Spain. “I’ve known the Accelonix team for many years and am thrilled to be working with them again. Their...
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ASE Chooses Cadence for SiP Design Worldwide

Cadence Design Systems Inc., a leader in global electronic-design innovation, and Advanced Semiconductor Engineering Inc.
Cadence Design Systems Inc. , a leader in global electronic-design innovation, and Advanced Semiconductor Engineering Inc. (ASE), the world's largest semiconductor packaging and test company, announced that ASE has selected Cadence® System-in-Package (SiP) design technology to provide high performance package design services to its customers throughout the world. "With...
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