Arlon’s EP2 (Advanced Polyimide) is a 4th generation polyimide technology, providing a filled, dimensionally stabilized product with improved copper peel and thermal conductivity – at a reduced cost vs. standard polyimides. A patent-pending chemistry that enhances the bond of polyimide to substrate, filler and copper is the enabling technology. These improvements coincide with improvements in signal integrity to deliver a material that redefines the boundaries for reliability, cost and performance.
