Teledyne Relays has introduced the SRF300/SRF303 series of ultraminature broadband TO-5 relays.

Designed to be a practical surface-mount solution that simplifies PC board manufacturing and solder joint inspection, the relay permits easy removal and replacement using hand tools. Hermetic construction provides a robust environmental package that will withstand RoHS process temperatures. The construction allows for submersion during the cleaning process with no after process operations needed.

Operating in the frequency band from DC to 6 GHz, the relays incorporate microwave cavities in the design. The cavities allow operation at higher frequencies with low insertion and return loss and high isolation. The relays are offered with two additional pins as customer specified options for good ground plane connection.

The relays use less board space than traditional relays and have a choice of 450mW (SRF300) or 200mW (SRF303) operating power. Performing over a wide temperature range of –55° to +85°C, the relays are also highly resistant to shock and vibration.

The SRF300 and SRF303 are designed for high speed digital switching applications, WiMAX applications, test and measurement equipment, high volume semiconductor manufacturing test environments and UWB applications.

RoHS compliance is achieved with the use of a Tin/Copper alloy (99.7%Sn, 0.3%Cu) terminal pin finish. This is specified by adding a ‘/R’ suffix to the part number, e.g. SRF303-5/R. Specifying the relay without the /R gives a Tin/Lead alloy (Sn60 or Sn63) pin finish.